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The FS50 Sn63 Pb37 Solder Paste is a premium-quality soldering solution designed for precision electronics assembly. This eutectic solder paste, containing 63% tin (Sn) and 37% lead (Pb), provides excellent wetting properties, superior joint strength, and consistent performance in both manual and automated soldering processes.

Features

  • Eutectic Composition (Sn63/Pb37): Ensures a sharp melting point at 183°C for reliable soldering.
  • Excellent Wettability: Provides uniform coverage and strong adhesion to components and PCB pads.
  • Superior Printability: Smooth and consistent application suitable for fine-pitch components.
  • Long Shelf Life: Stable formulation ensures performance over extended storage.
  • Low Voiding: Minimizes voids in solder joints, enhancing durability and conductivity.

Applications

  • PCB Assembly: Ideal for SMT (Surface Mount Technology) soldering.
  • Reflow Soldering: Compatible with modern reflow ovens for consistent results.
  • Repair and Prototyping: Perfect for touch-ups and prototyping in electronics manufacturing.
  • Fine-Pitch Components: Suitable for BGA, QFP, and other small-pitch packages.

Specification

Parameter Details
Composition Sn63 Pb37 (Tin 63%, Lead 37%)
Melting Point 183°C
Flux Type Rosin-based, halide-free
Viscosity Optimized for stencil printing
Shelf Life 6 months (refrigerated)
Application Method Stencil printing, dispensing, or manual application
Residue Non-corrosive, easily cleanable
Weight 32g

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FAQs

About Shipping Charges and delivery time
  1. Standard shipping: Rs 80 /- The order gets delivered within 4-6 working days. (6-7 days in case of the battery as it travels through the surface).
  2. Free shipping is applicable to the purchase of Rs.999 and above. The order gets delivered within 4-6 working days. (8-10 days in case of the battery as it travels through the surface)

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